Adhesive



comPosmous, comma R PLASTIC.

UNITED STATES PATENT OFFICE.

JOHN H. THICKENS, or BATHURST, NEW BRUNSWICK, CANADA, ASSIGNOR r0 THEBEAVER COMPANY, or BUFFALO, NEW YORK, A CORPORATION or OHIO.

gaging ADHESIVE.

Specification of Letters Patent. Patent d pl 1921 No Drawing. Originalapplication filed January 20, 1915, Serial No. 3,396. Divided and thisapplication filed December 27, 1917. Serial No. 209,058.

To all whom it may concern:

Be it known that I, JOHN H. Tnloxniss, a citizen of the United States,res ding at Bathurst, Province of New Brunswick, Dominion of Canada,have invented certain new and useful Improvements in Adhesives,

. (division of my application Serial No. 3,396,

filed January 20, 1915;) and I hereby declare the following to be afull, clear, and exact description of the invention,.such as will enableothers skilled in the art to which it appertains to make and use thesame.

The present invention relates to wall board and particularly to wallboard composed of a plurality of layers or plies of material.

It is an object of the present invention to produce a multi-ply board ofgreat rigidity, to insure a strong bond of the several plies to oneanother, to reduce waste in the manufacturing operation, and to lessenthe cost for adhesive material. With the'foregoing objects, and otherswhich will hereafter appear, I make use of a special silicate cementwhich can be compounded in convenient and economical manner, andwhichcan be used with marked advantage in binding or bonding the severalplies of material into a composite or multi-ply board.

In its preferred form, this silicate adheduces the silicate to a densityof approximately 35 Baum. The clay may be either refactory ornon-refractory, but prefer to use a non-refractory clay, since thisabsorbs the silicate more easily and is much easier to make. The clayshould be fine enough to pass through a 100 mesh sieve.

The operation of mixing the foregoing 1ngredients may be carried out inseveral ways, and a satisfactory procedure is as follows: The requiredamount of silicate is run into a mixing machine, the one which I use isof the Dopp t pe, and the water and clay are there adde and the mixtureis agitated for a period of approximately a half hour, or until athorough mechamcal mixing is secured. After this, the mixture is run toa storage tank where it is allowed to remain for a period of about onehour, or until the clay absorbs all of the silicate which it can absorb.When the water is added to the silicate in the mixing machine, thedensity The mixture above described sets much slower than an ordinarysilicate adhesive as used in the wall board art and gives a muchstronger bond, and at the same time by its increased viscosity makespossible a more eificient laminating with less waste in themanufacturing operation.

The several plies or layers of material to which this adhesive is to beapplied may be of material commonly used in the manufacture of wallboard, such as ground wood pulp or waste paper or cooked pulp used aloneor intermixed, and the several plies to be pasted or cemented togethermay be of different material, as, for instance, ground wood layersalternating with cooked wood layers.

The adhesive may be applied in the usual manner, due allowance beingmade for its greater viscosity, and for its retarded setting, and wallboards thus constructed are strongly bonded together and have a rigiditymuch greater than when made with ordinary silicate, this increaseamounting to from 20% to 30%, the expense for adhesive is materiallyreduced because of the diluting and distributing action of thepulverized clay, and I harve found that in practice there is a markedreduction in the waste of manufacture.

Wall boards constructed as above described may be used generally as abuilding material by nailing or tacking directly to the studding of aroom where they serve in place of lath and plaster as in inner wall ofthe room, bein ornamented with paint or the like as esired. After thesilicate is once set, the bonding between plies is permanent, and thereis in the bonding material no in redient likely to deteriorate with ageor with changing atmospheric conditions, and no material likely tosoften or become impaired by heat as when the wall board is used aroundregisters or radiators or the like.

I claim:-

1. The process which consists in thoroughly mixing sodium silicate ofabout 35 Baum with about 80% by weight of clay, and allowing the mixtureto stand for aperiod of about an hour to permit the clay to absorbsilicate, thereby producing a slowsetting adhesive of relatively highviscosity suitable for use in bonding the plies of a laminated wallboard, substantially as described.

2. The process which consists in thoroughly mixing sodium silicate ofabout 35 Baum with about 80% by weight of nonrefractory clay, bymechanical agitation for about a half hour, and then allowing themixture to stand until the clay absorbs all of the silicate which it canabsorb, thereby producing a slow-setting adhesive of relatively highviscosity suitable for use in bonding the plies of a laminated wallboard, substantially as described.

3. The process of producing a clay silicate adhesive of relatively highviscosity suitable for use in bonding the plies of a laminated wallboard which consists in thoroughly mixing an aqueous solution of sodiumsilicate with ,a substantial amount of clay, such mixin being effectedby mechanical agitation 0? the mixture for about one-half hour, and thenallowing the mixture to stand for a period of about one hour so as topermit the clay to absorb the silicate solution to the necessary extent.

4:. The process of producing a clay silicate adhesive of relatively highviscosity suitable for use in bonding the plies of a laminated wallboard which comprises me chaznically agitating for a period of at leastone half hour a mixture of an aqueous solutionof sodium silicate andclay, the clay being fine enough to pass through 100 mesh sieve, andthen allowing the mixture to stand for at least one hour so as to permitthe clay to absorb the silicate solution to the necessary extent.

In testimony whereof I aflix my signature.

JOHN H. THICKENS.

